This MicroCare technical article, Why Clean a No-Clean Flux, explores the growing necessity of cleaning no-clean solder pastes in modern PCB manufacturing. While no-clean fluxes were originally developed to eliminate post-reflow cleaning, increasing circuit density, miniaturization, and reliability demands—especially in medical, aerospace, and military electronics—have made cleaning these residues essential. The article outlines the risks of leaving no-clean residues, such as electrochemical migration, dendrite growth, and coating failure. It also highlights benefits like improved performance, easier inspection, enhanced coating adhesion, and aesthetic quality. Best practices include early specification, batch testing, compatibility checks, and using safe, effective flux removers to ensure long-term PCB reliability
