The Comet Semiconductor Portfolio showcases advanced X-ray and CT inspection solutions for front-end and back-end semiconductor manufacturing. Powered by AI-driven metrology and Dragonfly software, Comet systems deliver submicron imaging, automated defect detection, in-line wafer inspection, TSV and bump metrology, and high-throughput 2.5D/3D analysis. From lab to fab, these solutions improve yield, shorten time-to-market, and enhance quality across advanced packaging, wafer processing, chip production, and R&D.
