The Akrometrix PS600T Thermal Warpage System delivers fast, high-resolution thermal surface topography with multi-zone top and bottom heating for realistic reflow emulation. Supporting substrates up to 600 × 600 mm, 1-micron Z resolution, and 2-second full-field measurements, it enables precise warpage, strain, and CTE analysis for PCBs, wafers, panels, advanced packaging, and semiconductor devices.
