Printed Circuit Board Design can Impact Electrochemical Reliability

As electronics continue to shrink and deliver higher performance, Bottom Terminated Components (BTCs) are increasingly critical in advanced PCB assemblies. While they offer excellent thermal, electrical, and space-saving advantages, BTCs also present unique reliability risk, including dendritic growth, leakage currents, and corrosion from trapped flux residues. This study, guided by IPC 7093A design standards, evaluates how design elements like thermal vias, solder mask strategies, and pad configurations directly influence surface insulation resistance (SIR) and long-term electrochemical reliability. Findings show that optimizing flux outgassing channels and via structures significantly improves reliability, reduces failure risk, and ensures more robust assemblies.