The MIRTEC MS-11 3D SPI Series delivers industry-leading accuracy and process control for solder paste inspection, combining high-resolution 15MP/25MP CoaXPress imaging with advanced shadow-free Moiré technology for precise 3D measurement. Designed for maximum reliability, it features automated Z-height calibration, PCB warpage compensation, and closed-loop communication with screen printers to optimize production quality in real time. With powerful automation, repeatability, and INTELLISYS® Industry 4.0 integration, the MS-11 ensures consistent, high-performance inspection for today’s demanding electronics manufacturing environments.
