DIC3 Digital Image Correlation Module - Product Brochure

The Akrometrix DIC3 Digital Image Correlation Module enables fast, high-resolution thermal strain and CTE measurement across virtually any substrate. Compatible with the AXP3 and PS600T platforms, it delivers full-field displacement and strain analysis in as little as one second, with sub-micron XY resolution and automated setup for PCBs, wafers, panels, advanced packaging, and semiconductor applications.