Designing A Cleanliness Risk Profile on Leadless & Near Chip Scale Packages

As the electronics industry moves toward leadless and near chip-scale packages, reliability challenges grow due to smaller standoff gaps, higher I/O counts, and trapped flux residues. These factors can lead to electrochemical migration, leakage currents, and long-term failures if not properly addressed. This study by Magnalytix demonstrates how designing a Cleanliness Risk Profile using Surface Insulation Resistance (SIR) testing, custom test boards, and materials characterization helps engineers proactively identify contamination risks. By evaluating solder mask strategies, thermal via design, flux behavior, and rework processes, the research provides manufacturers with tools to optimize designs and processes for greater reliability, reduced failures, and improved product longevity in high-density electronic assemblies.